GC800# Semiconductor Wafer Lapping Powder Green Silicon Carbide
Introduction
GC800# Green Silicon Carbide (SiC) lapping powder is a high-purity, synthetic abrasive material engineered to meet the precise and demanding requirements of semiconductor wafer lapping and polishing.
This product is specifically designed for applications where exceptional surface finish, flatness, and minimal sub-surface damage are critical for the performance of integrated circuits.
Its superior hardness and controlled particle morphology make it an ideal choice for advanced semiconductor manufacturing processes.
PHYSICAL PROPERTIES
| Specific Weight | 3.95 g/ cm3 |
| Mohs Hardness | 9.5 |
| Maximum service temperature | 1900℃ |
| Melting Point | 2250℃ |
TTYPICAL CHEMICAL ANALISIS [%]
| SiC | Fe2O3 | F.C | F.Si | SiO2 | LOI |
| 98.0-99.5 | ≤0.15 | ≤0.30 | ≤0.40 | ≤0.70 | < 0.09 |
APARTICLE SIZE DISTRIBUTION
CHAPTER Ⅰ（JIS STANDARD）
| Size | DO(um) | D3(um) | D50(um) | D94(um) |
| #240 | ≤127 | ≤103 | 57.0±3.0 | ≥40 |
| #280 | ≤112 | ≤87 | 48.0±3.0 | ≥33 |
| #320 | ≤98 | ≤74 | 40.0±2.5 | ≥27 |
| #360 | ≤86 | ≤66 | 35.0±2.0 | ≥23 |
| #400 | ≤75 | ≤58 | 30.0±2.0 | ≥20 |
| #500 | ≤63 | ≤50 | 25.0±2.0 | ≥16 |
| #600 | ≤53 | ≤41 | 20.0±1.5 | ≥13 |
| #700 | ≤45 | ≤37 | 17.0±1.5 | ≥11 |
| #800 | ≤38 | ≤31 | 14.0±1.0 | ≥9.0 |
| #1000 | ≤32 | ≤27 | 11.5±1.0 | ≥7.0 |
| #1200 | ≤27 | ≤23 | 9.5±0.8 | ≥5.5 |
| #1500 | ≤23 | ≤20 | 8.0±0.6 | ≥4.5 |
| #2000 | ≤19 | ≤17 | 6.7±0.6 | ≥4.0 |
| #2500 | ≤16 | ≤14 | 5.5±0.5 | ≥3.0 |
| #3000 | ≤13 | ≤11 | 4.0±0.5 | ≥2.0 |
| #4000 | ≤11 | ≤8.0 | 3.0±0.4 | ≥1.8 |
| #6000 | ≤8.0 | ≤5.0 | 2.0±0.4 | ≥0.8 |
| #8000 | ≤6.0 | ≤3.5 | 1.2±0.3 | ≥0.6 |
CHAPTER Ⅱ（FEPA STANDARD）
| Size | D3(um) | D50(um) | D94（um) |
| F230 | ＜82 | 53.0±3.0 | >34 |
| F240 | ＜70 | 44.5±2.0 | >28 |
| F280 | ＜59 | 36.5±1.5 | >22 |
| F320 | ＜49 | 29.2±1.5 | >16.5 |
| F360 | ＜40 | 22.8±1.5 | >12 |
| F400 | ＜32 | 17.3±1.0 | >8 |
| F500 | ＜25 | 12.8±1.0 | >5 |
| F600 | ＜19 | 9.3±1.0 | >3 |
| F800 | ＜14 | 6.5±1.0 | >2 |
| F1000 | ＜10 | 4.5±0.8 | >1 |
| F1200 | ＜7 | 3.0±0.5 | >1(at 80%) |
| F1500 | ＜5 | 2.0±0.4 | >0.8(at 80%) |
| F2000 | ＜3.5 | 1.2±0.3 | >0.5(at 80%) |
Mainly Applications
-Bonded Abrasives and Coated abrasives
-Blasting,surface Treatment,Rust Removal
-Wet and dry blast media,grinding and polishing etc
-Floor/Wall laminates,Wear-resistant
-Ceramic products: Ceramic and Tiles,Ceramic filter plate,ceramic membrane etc
-Teflon painting etc
– Heat insulating material
-Grinding wheels,Cup wheels,Whetstone,polishing pads etc
-Used for crucibles, parts for kiln burning, mechanical seals, and parts materials to produce semiconductors
İncelemeler
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